Corporation (NASDAQ:CYBE), a world leader in intelligent inspection
and sensing solutions for electronics assembly and semiconductor process
equipment, will demonstrate its wireless measurement devices for chamber
gapping, leveling, wafer handoff teaching, vibration and airborne
particle measurement, at SEMICON
Taiwan in Booth #426 and #672 at the TWC in Nangang District, Taipei
City, Sept. 3-5, 2014.
To address the market demand for airborne particle measurement in 150mm
semiconductor, gallium arsenide (GaAs), LED and flat panel display fabs,
CyberOptics will also highlight the new WaferSense Airborne Particle
Sensor APS2 150C, its most recent extension of its APS line in a 150mm
wafer form factor. The new APS2 150C incorporates advanced technology
with a 60% increase in particle sensitivity at <10 false counts per hour.
"CyberOptics continues to help customers exceed manufacturing quality
and productivity standards while improving equipment set-up, uptime and
long term yields," said Ferris Chen, Director of Sales, CyberOptics.
"Semiconductor fabs and OEMs value the accuracy, efficiency and
precision of the industry-leading wireless airborne particle sensor.
Further increasing the particle sensitivity by 60% demonstrates our
commitment to technology advancements that deliver even more value for
our customers in terms of time and expense savings."
With APS technology, equipment engineers can quickly and wirelessly
monitor, identify and troubleshoot airborne particles in rel-time
within semiconductor process equipment and automated material handling
systems. WaferSense® and ReticleSense™ Airborne Particle Sensors enable
equipment engineers to shorten equipment qualification, release to
production and maintenance cycles all while reducing expenses. Customers
have experienced up to 88% time savings, up to 95% reduction in costs,
and up to 20X the through-put with half the manpower resource
requirements using the WaferSense APS relative to legacy surface scan
wafer methods. The advanced technology capabilities result in increased
particle sensitivity further maximizing these key customer benefits.
CyberOptics will showcase the full suite of industry-leading wireless
WaferSense measurement devices including the Airborne Particle Sensor
(APS), Auto Vibration System (AVS), Auto Leveling System (ALS), Auto
Teaching System (ATS) and the Auto Gapping System (AGS). The recently
announced ReticleSense Airborne Particle Sensor (APSR) measurement
device will also be featured.
About the WaferSense Line
The WaferSense measurement portfolio including the Auto Leveling System
(ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS),
the Auto Teaching System (ATS) and the Airborne Particle Sensor (APS)
are available now in 200mm, 300mm and 450mm wafer sizes. Additionally,
both APS and ALS are available in 150mm sizes. The ReticleSense Airborne
Particle Sensor (APSR) and ReticleSense Auto Leveling System (ALSR)
products are available in a reticle shaped form factor.
For more information about the entire line of CyberOptics solutions
please visit the company's website at www.cyberoptics.com.
The company has also launched a Chinese site to focus on needs of the
Asia Pacific region at http://zh-cn.cyberoptics.com.
Founded in 1984, CyberOptics Corporation is a leading provider of
sensors and inspection systems that provide process yield and
through-put improvement solutions for the global electronic assembly and
semiconductor capital equipment markets. Our products are deployed on
production lines that manufacture surface mount technology circuit
boards and semiconductor process equipment. Through internal development
and acquisitions, CyberOptics is strategically repositioning itself to
become a global leader in high-precision 3D sensors. Headquartered in
Minneapolis, Minnesota, CyberOptics conducts worldwide operations
through facilities in North America, Asia and Europe.
Statements regarding the Company's anticipated performance are
forward-looking and therefore involve risks and uncertainties, including
but not limited to: market conditions in the global SMT and
semiconductor capital equipment industries; increasing price competition
and price pressure on our product sales, particularly our SMT systems;
the level of orders from our OEM customers; the availability of parts
required for meeting customer orders; unanticipated product development
challenges; the effect of world events on our sales, the majority of
which are from foreign customers; product introductions and pricing by
our competitors; the level of revenue and loss we record in 2014; the
success of our 3D technology initiatives; expectations regarding LDI and
its impact on our operations; integration risks associated with LDI and
other factors set forth in the Company's filings with the Securities and
All names are trademarks of their respective companies.
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