Advanced Semiconductor Engineering, Inc. (TAIEX:2311) (NYSE:ASX), the
world's largest semiconductor assembly and test service provider, today
announced that it has been selected by Bosch Sensortec GmbH as a key
manufacturing and technology partner for production of a leading edge
sensor device. Through utilizing advanced wafer level packaging
technologies developed at ASE, Bosch Sensortec has successfully brought
to market the industry's smallest 3-axis MEMS accelerometer available
today. Geared towards highly integrated low-power consumer electronics
applications, this leading edge sensor device features digital
interfaces in an advanced wafer level chip scale package.
With sensor technologies playing an integral role in emerging
applications within the Internet of Things and the smart world evolving
around us, there is high demand for innovative IC packaging solutions to
meet stringent performance, efficiency, and footprint requirements. As
an industry leader, ASE was one of the world's first providers of wafer
level packaging, which enables the smallest package size possible, that
being the same size as the die itself. ASE's proven WLCSP portfolio
includes an expanding scope of highly customizable options, encompassing
technologies such as high density routing, very thin WLCSPs, low
temperature processing, enhanced WLCSP Structures and materials, Wafer
Level integrated passives, 3D WLPs, WL MEMS, and embedded die packaging.
"As Bosch Sensortec moved forward with our latest sensor technology, it
was clear that we needed a solid and reliable partner that could
effectively deliver both the technology and manufacturing capabilities
required to bring our product to a dynamic market in a timely fashion,"
said Wolfgang Lohner, Chief Financial Officer, Bosch Sensortec GmbH.
Lohner added, "ASE successfully delivered on both fronts, and this is
testament to their demonstrated expertise and dedicated focus in
evolving their technologies so we could deliver ours to our customers,
and ultimately to the world beyond."
"Semiconductor industry trends towards smaller and thinner form factors
is providing major impetus for ASE to explore and develop unique
packaging techniques using innovative material and process
technologies," said Fuyu Shih, Vice President of Sales and Marketing,
ASE Europe. "ASE is continuously aligning the evolution of our packaging
portfolio with the highly intricate technology requirements of our
customer base, and our partnership with Bosch Sensortec encompassed key
strategic collaboration on advanced technologies involving both WLCSP
Shih elaborated, "Driven by mutual desire to innovate and create, while
addressing new demands related to product integration, mobility, and
reliability, ASE is pleased that our deep technology integration with
Bosch Sensortec produced a milestone sensor device, hence positioning
them well within the market."
About Bosch Sensortec GmbH
Bosch Sensortec GmbH is a fully owned subsidiary of Robert Bosch GmbH,
dedicated to the consumer electronics world offering a complete
portfolio of micro-electro mechanical systems (MEMS) sensors and
solutions that enable mobile devices to feel and sense the world around
them. Bosch Sensortec develops and markets a wide portfolio of MEMS
sensors and solutions for smart phones, tablets, wearable devices and
IoTS (Internet of Things & Services) applications.
The product portfolio includes 3-axis acceleration, gyroscope and
geomagnetic sensors, integrated 6- and 9-axis as well as environmental
sensors and a comprehensive software portfolio. Since its foundation in
2005 Bosch Sensortec emerged as the technology leader in the addressed
markets. The Bosch Group has been the global market leader for MEMS
sensors since 1998 and has to date sold more than 4 billion MEMS sensors.
For more information, go to www.bosch-sensortec.com.
About The ASE Group
The ASE Group is the world's largest provider of independent
semiconductor manufacturing services in assembly, test, materials and
design manufacturing. As a global leader geared towards meeting the
industry's ever growing needs for faster, smaller and higher performance
chips, the Group develops and offers a wide portfolio of technology and
solutions including IC test program design, front-end engineering test,
wafer probe, wafer bump, substrate design and supply, wafer level
package, flip chip, system-in-package, final test and electronic
manufacturing services through Universal Scientific Industrial Co Ltd, a
member of the ASE Group. The Group generated sales revenues of US$7.4
billion in 2013 and currently employs 67,000 people worldwide.
For more information about the ASE Group, visit www.aseglobal.com.
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