Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company") today announced
that STATS ChipPAC (SGX-ST Code: S24) honored the company with a
Supplier Award on July 22, 2014.
STATS ChipPAC recognized K&S with an "Outstanding Award in Service and
Support" for 2013. It honors material and equipment suppliers who
distinguished themselves by providing excellent service, support, and
responsiveness, while being aligned with and supporting their technology
roadmap for the long term business requirements of STATS ChipPAC and
"We are pleased to recognize K&S with our Outstanding Award in Service
and Support for 2013," said Cindy Palar, Senior Vice President of
Strategic Operations, STATS ChipPAC. "K&S delivered a strong performance
in 2013 and continues to be an important strategic supplier for our
copper wire bond business. Their technology and equipment is well
aligned with our customer base and initiatives, such as the UPH
improvement program, that has been an important advantage for STATS
ChipPAC and our customers. We value the regular and timely technology
updates to our operations team every quarter and the ongoing training
that K&am;S provides to each of our manufacturing sites. K&S
responsiveness, excellent sales support, and overall flexibility in
delivery dates for our factories have been appreciated."
Mr. Bruno Guilmart, President and CEO of the Company said, "As we
continue to focus on delivering technologically advanced, innovative
products and total solutions to our customers, it's an honor to be
recognized for our efforts in the past year. We thank STATS ChipPAC for
this recognition, and we look forward to a continued strong partnership
in the future."
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor and LED assembly equipment. As a pioneer in
this industry, K&S has provided customers with market leading packaging
solutions for decades. In recent years, K&S has expanded its product
offerings through strategic acquisitions, adding wedge bonding and a
broader range of expendable tools to its core ball bonding products.
Combined with its extensive expertise in process technology, K&S is well
positioned to help customers meet the challenges of assembling the
next-generation semiconductor and LED devices. (www.kns.com)
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of
semiconductor packaging design, assembly, test and distribution
solutions in diverse end market applications including communications,
digital consumer and computing. With global headquarters in Singapore,
STATS ChipPAC has design, research and development, manufacturing or
customer support offices throughout Asia, the United States and Europe.
STATS ChipPAC is listed on the SGX-ST. Further information is available
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