Research and Markets (http://www.researchandmarkets.com/research/5pz2j7/system_in_package)
has announced the addition of the "System
in Package (SIP) Market by Technology, Type, Interconnection Technology,
Applications and Geography - Global Trends & Forecasts to - 2014 - 2020"
report to their offering.
The rapid expansion of the System in Package (SiP) market has inspired
research and development in System in Package (SiP) associated
technology by Integrated Device Manufacturers (IDM) as well as
Electronic Manufacturing Services (EMS) providers and Semiconductor
Assembly Services (SAS). With this evolution of System in Package (SiP)
technology during the last few decades, the future trend for System in
Package (SiP) technology in the next decade or two will be clearer if we
look at the future electronics market sectors such as mobile products,
high-end computers, automobiles, flat-panel High-Definition TVs (HDTVs),
and sensors for security, health care, and environment. The consumer
mobile products will advance to more multi functionality, thus,
realizing the digital convergent dream with flexible displays with LED
as a light source, thin film, or nano batteries.
System on Package (SOP) is an emerging trend in the system
miniaturization technology in divergence to System-on-Chip (SOC) at IC
level and System in Package (SiP) at module level. System in Package
(SiP) is obtained by thinning ICs from its original 800 micron thick
wafer dimensions to 50 microns and stacking as many as 10 of these, one
on top of the other, in 3D form. These are then interconnected by either
wire bond or flip-chip technology. The current Through Silicon via (TSV)
developments have further condensed System in Package (SiP) by replacing
flip chip with pad to pad bonding.
The capability to integrate different technologies and to reduce total
production cost and time to market are the prime drivers for System in
Package (SiP) packaging. System in Package (SiP) has enabled the rapid
integration of active and passive devices into single package solutions.
This approach has also reduced product costs, allowing systems to be
partitioned into the most cost-effective blocks. The stacked System in
Package (SiP) alignments reduce the system size and eliminate the cost
of individual packages for each die. They also improve signal
transmission times and reduced power by minimizing capacitive loads
For more information visit http://www.researchandmarkets.com/research/5pz2j7/system_in_package
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