Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it will
participate in the Barclays High Yield Bond and Syndicated Loan
Conference on Tuesday, May 13, 2014. Amkor's presentation will occur at
7:30 am Pacific Time (10:30 am Eastern Time) at the Arizona Biltmore
Hotel in Phoenix, Arizona.
An audio-only webcast of the presentation will be made vailable, both
live and by replay, on the Investor Relations section of Amkor's website.
Amkor is a leading provider of semiconductor packaging and test services
to semiconductor companies and electronics OEMs. More information about
Amkor is available from the company's filings with the Securities and
Exchange Commission and on Amkor's website: www.amkor.com.
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