Corporation (TOKYO:6502) today announced that the company will
collaborate with GLOBALFOUNDRIES in the manufacture of Toshiba's FFSATM
(Fit Fast Structured Array) products. Toshiba will expand its FFSATM
business through production at GLOBALFOUNDRIES's fabs. Initial
products will be manufactured using GLOBALFOUNDRIES 65nm-LPe and 40nm-LP
processes, with plans to extend the collaboration to the company's 28nm
High-K Metal Gate (HKMG) technology.
Toshiba's FFSATM products, developed in collaboration with
BaySand Inc. of the U.S., can be configured simply by customizing the
design of a few metal layers. This customization process secures a much
shorter development turn-around-time than with conventional ASIC
devices, and satisfies increasing market needs for high performance,
high specifications and low power technologies. At a time of
ever-shorter product life cycles, time available for development is at a
premium, and solutions that meet demand and allow tweaking of the
specifications until just before the start of trial production increase
the freedom and flexibility of developers.
Toshiba recognizes that it is important to shorten both the production
period and the layout design period, in order to provide customers with
samples with a very short turn-around-time. The flexible response made
possible through collaboration with GLOBALFOUNRIES, will secure this,
and allow Toshiba to produce samples in five weeks from design hand-off,
a fifth of the time required for conventional ASICs.
"The FFSATM product series is one of our key strategic LSIs,"
said Masakazu Kakumu, Corporate Vice President, Toshiba Corporation and
Executive Vice President, Toshiba Corporation Semiconductor & Storage
Products Company. "We decided to partner with GLOBALFOUDRIES to
manufacture FFSATM wafers because it allows us to achieve the
short turn-around time crucial to FFSATM, for both
engineering samples and mass production. It also ensures that we can
support high quality and yields with high volume capacity."
"We are very pleased to have been selected as the primary wafer foundry
for Toshiba's FFSA products," said Chuck Fox, senior vice president of
worldwide sales at GLOBALFOUNDRIES. "With development costs for today's
SoC products becoming out of reach for many companies, Toshiba's FFSA
technology can dramatically reduce development costs and manufacturing
cycle times by customizing only a few interconnect layers."
The two companies will seek to deepen their relationship to provide
customers with the best solutions.
Note : FFSA is a trademark of Toshiba Corporation.
For more information, please visit following website:http://www.semicon.toshiba.co.jp/eng/product/asic/type/sa/index.htmlhttps://www.ffsa.semicon.toshiba.co.jp/
Toshiba is a world-leading diversified manufacturer, solutions provider
and marketer of advanced electronic and electrical products and systems.
Toshiba Group brings innovation and imagination to a wide range of
businesses: digital products, including LCD TVs, notebook PCs, retail
solutions and MFPs; electronic devices, including semiconductors,
storage products and materials; industrial and social infrastructure
systems, including power generation systems, smart community solutions,
medical systems and escalators & elevators; and home appliances.
Toshiba was founded in 1875, and today operates a global network of more
than 590 consolidated companies, with 206,000 employees worldwide and
annual sales surpassing 5.8 trillion yen (US$61 billion). Visit
Toshiba's web site at www.toshiba.co.jp/index.htm
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