Research and Markets (http://www.researchandmarkets.com/research/kxdl6h/global)
has announced the addition of the "Global
Wafer-level Packaging Equipment Market 2014-2018" report to
To sustain the competition in the market, semiconductor manufacturers
are continuously introducing innovative products, reducing manufacturing
costs, and improving product efficiency. For instance, they have
introduced chips that are available in smaller sizes; the sizes of these
chips have reduced from 45 nanometers to 22 nanometers. They have also
introduced chips with high dielectric constant materials and fin-fet or
tri-gate transistors. In addition, DRAM memory manufacturers are
currntly employing 3x node production technology and 2x node production
technology for the production of DRAMs. As these innovations require
highly complicated wafer-level packaging equipment, the increase in the
number of innovations by semiconductor manufacturers is likely to foster
their demand in the market.
According to the report, the most important driver is the increasing
adoption of mobile devices. Over the past decade there has been an
unprecedented growth in the adoption of mobile devices such as cell
phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This
has led to a consequential rise in the demand for wafer-level packaging
equipment, as it is vital for the functioning of mobile devices.
Further, the report states that one of the key challenges in this market
is the cyclical nature of the Semiconductor industry, which leads to
fluctuations in the demand for wafer-level packaging equipment.
Moreover, in some cases, the production of such equipment tends to
exceed their demand, leading to a large demand-supply gap.
Key vendors dominating this space are:
Other vendors mentioned in the report are:
For more information visit http://www.researchandmarkets.com/research/kxdl6h/global
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