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TMCNet:  Freescale Semiconductor Assigned Patent for Method of Assembling Semiconductor Device Including Insulating Substrate and Heat Sink

[February 07, 2014]

Freescale Semiconductor Assigned Patent for Method of Assembling Semiconductor Device Including Insulating Substrate and Heat Sink

(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,170) developed by Junhua Luo, Tianjin, China, Jinzhong Yao, Tianjin, China, and Baoguan Yin, Tianjin, China, for a "method of assembling semiconductor device including insulating substrate and heat sink." The patent application was filed on April 10, 2012 (13/442,878). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=3&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=104&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&s2=%28TX.ASST.%29&OS=ISD/02/04/2014+AND+AS/TX&RS=ISD/02/04/2014+AND+AS/TX Written by Balkishan Dalai; edited by Jaya Anand.


BD0207JA0207-976595 (c) 2014 Targeted News Service

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