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[February 07, 2014]
Freescale Semiconductor Assigned Patent for Method of Assembling Semiconductor Device Including Insulating Substrate and Heat Sink
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,170) developed by Junhua Luo, Tianjin, China, Jinzhong Yao, Tianjin, China, and Baoguan Yin, Tianjin, China, for a "method of assembling semiconductor device including insulating substrate and heat sink." The patent application was filed on April 10, 2012 (13/442,878). The full-text of the patent can be found at
Written by Balkishan Dalai; edited by Jaya Anand.
BD0207JA0207-976595 (c) 2014 Targeted News Service
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