Advertise with us
[February 07, 2014]
Freescale Semiconductor Assigned Patent for Encapsulant for Semiconductor Device
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,197) developed by four co-inventors for "encapsulant for a semiconductor device." The co-inventors are Sheila F. Chopin, Round Rock, Texas, Varughese Mathew, Austin, Texas, Leo M. Higgins III, Austin, Texas, and Chu-Chung Lee, Round Rock, Texas.
The patent application was filed on Oct. 15, 2012 (13/651,995). The full-text of the patent can be found at
Written by Balkishan Dalai; edited by Jaya Anand.
BD0207JA0207-976592 (c) 2014 Targeted News Service
Back To NFVZone's Homepage