Analog/mixed-signal foundry group X-FAB
Silicon Foundries today announced its collaboration with
Belgian-based micro- and nanoelectronics research center imec
to offer multi-project wafer runs through imec's EUROPRACTICE
IC Service for X-FAB's 0.18 micrometer SOI HV process (XT018) and a
junction-isolated HV process (XH018). The offered service enables small
start-ups and academic institutions throughout Europe to access the full
functionality of X-FAB's unique high-voltage/low-power 0.18 micrometer
technology and prototype ASIC designs in a very cost-effective way.
Imec is one of the world's leading independent R&D institutes for
nano-electronics and semiconductors. The EUROPRACTICE IC Service offered
by imec and Fraunhofer brings ASIC design and manufacturing capability
within the technical and financial reach of anyone who wishes to use
ASICs. It offers low-cost ASIC prototyping and small volume production
ramp-up to European universities and publicly funded research institutes
for microelectronic and microsystem design through multi-project wafer
(MPW) and dedicated wafer runs. To see the X-FAB listings on the MPW
schedule for 2014, please click here.
X-FAB CEO Rudi De Winter said, "Through our cooperation with imec's
EUROPRACTICE Service we access an innovative network of start-up
companies, universities and institutes across Europe. One growth area in
which Europe is playing a leading role is the More than Moore domain.
Offering technologies to integrate more and more functions in one IC,
such as analog components, high-voltage electronics, non-volatile
memories and controllers is X-FAB's core competency. We believe that our
collaboration with imec offers new opportunities for semiconductor
researchers and developers in Europe to continue to innovate in the
field of More than Moore."
is the first and only 0.18 micrometer platform with high-temperature,
high-voltage (HV) and non-volatile memory (NVM) capability including
Flash and NVRAM IP. This modular mixed-signal high-voltage CMOS
technology extends the operating temperature range of integrated
circuits to +175°C. With the ability to integrate HV and NVM in a single
platform, it is ideal for automotive applications and for motor control
and power management or power-conversion applications for a wide range
of voltages in industrial, medical and consumer systems.
is the only trench dielectric isolated SOI foundry process with 200V MOS
capability at 180nm. With an operating temperature range of -40 to
175°C, it supports a new generation of cost-effective "Super Smart
Power" technologies. The XT018 process is ideally suited for
high-performance systems requiring multiple voltage domains integrated
and isolated in one chip. For example, it is useful for medical
ultrasound applications and for applications that need bidirectional
isolation, such as piezo actuators and capacitive-driven micromechanics.
MPW service for X-FAB's XT018 and XH018 technology is available now
through EUROPRACTICE at: http://www.europractice-ic.com/technologies_XFAB.php.
X-FAB is the leading analog/mixed-signal foundry group manufacturing
silicon wafers for analog-digital integrated circuits (mixed-signal
ICs). X-FAB maintains wafer production facilities in Erfurt, Dresden and
Itzehoe (Germany), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia),
and employs approximately 2,400 people worldwide. It manufactures wafers
based on advanced modular CMOS and BiCMOS processes with technologies
ranging from 1.0 to 0.13 micrometers, for applications primarily in the
automotive, communications, consumer and industrial sectors. For more
information, please visit www.xfab.com.
Application-Specific Integrated Circuit
Bi-polar Complementary Metal-Oxide-Semiconductor
Research and Development
Silicon on Insulator
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