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[August 19, 2013]
Columbia University Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Aug. 19 -- Columbia University, New York, has been assigned a patent (8,507,368) developed by James S. Im, New York, for a "single-shot semiconductor processing system and method having various irradiation patterns." The abstract of the patent published by the U.S. Patent and Trademark Office states: "High throughput systems and processes for recrystallizing thin film semiconductors that have been deposited at low temperatures on a substrate are provided. A thin film semiconductor workpiece is irradiated with a laser beam to melt and recrystallize target areas of the surface exposed to the laser beam. The laser beam is shaped into one or more pulses. The beam pulses have suitable dimensions and orientations to pattern the laser beam radiation so that the areas targeted by the beam have dimensions and orientations that are conductive to semiconductor recrystallization. The workpiece is mechanically translated along linear paths relative to the laser beam to process the entire surface of the workpiece at high speeds. Position sensitive triggering of a laser can be used to generate laser beam pulses to melt and recrystallize semiconductor material at precise locations on the surface of the workpiece while it is translated on a motorized stage." The patent application was filed on Aug. 23, 2012 (13/592,843). The full-text of the patent can be found at
Written by Kusum Sangma; edited by Anand Kumar.
KS0819AK0819-913844 (c) 2013 Targeted News Service
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