The rapidly growing application of SlurryScope™ systems at major
semiconductor wafer fabs has begun to stimulate the need for tighter
collaboration between nanometer-node process developers and the wafer
fab managers who oversee the quality/delivery of slurry used during
chemical-mechanical planarization (CMP) process. Minimizing large
particle counts (LPCs) in undiluted slurry at wafer planarization and
polishing steps is becoming increasingly critical as complex chips are
manufactured at ever finer geometries.
"Our SlurryScope systems continue to affirm correlations between LPCs
and yield-diminishing wafer scratches," asserted Paul Magliocco, Vantage
CEO. "Not surprisingly, the most advanced process development teams
working at the 28nm node and beyond are asking for continuous analyses
of undiluted slurry from their wafer fab colleagues."
Magliocco expects the growing concern over LPCs to result in his firm's
real-time metrology tool to be increasingly embedded at all critical CMP
and Slurry Delivery System (SDS) steps. "We are pleased to see that the
SlurryScope data is improving the dialogue between process and materials
teams. By providing more data to use, our tool is proving invaluable in
detecting potentially damaging LPCs in tie to allow corrective action
to be taken."
SlurryScope shipments continue to ramp with repeat multiple orders
coming from global wafer fabs. The company continues to demonstrate its
innovative tool at Semicon trade shows around the globe. When Semicon
Korea opens its three-day run in Seoul on January 30th, the
SlurryScope System will be demonstrated by SEOIL
E&M Co., Ltd. (Booth # 1448, COEX
About Vantage Technology
Operating from headquarters in Campbell, California, Vantage Technology
Corporation was founded in 2010 by a cadre of Silicon Valley veterans
with extensive experience in wafer fab production and test equipment.
Focused on developing real-time micro-analytical metrology tools using
advanced laser technology, proprietary algorithms and multicore image
processing techniques, the company has targeted its first product at the
semiconductor industry. Called the SlurryScope™ system, this real-time
tool continuously detects large particles in undiluted slurry. Early
detection of oversized particles enables timely corrective action that
can minimize wafer micro-scratches and other defects caused by particle
agglomeration during the chemical-mechanical planarization process. For
more information, visit www.VantageTechCorp.com.
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