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[December 23, 2012]
Canon U.S.A. Debuts New FPA-3030i5+ Stepper [Manufacturing Close - Up]
(Manufacturing Close - Up Via Acquire Media NewsEdge) Canon U.S.A., Inc., a company focusing on digital imaging solutions, recently launched sales of the new FPA-3030i5+ i-line stepper.
According to the company, the FPA-3030i5+ is designed to provide a long-term manufacturing solution for manufacturers of energy- efficient, environmentally conscious devices including Light- Emitting Diodes (LEDs),MicroElectroMechanical Systems (MEMS) and power semiconductors*3.
As awareness of clean energy and energy conservation continues to increase, demand has simultaneously increased for new environmentally conscious technologies including wind and solar power, high-efficiency vehicles and low-power facilities. As a result, manufacturers of these devices have process requirements that have been incorporated into the FPA-3030i5+ semiconductor stepper design that, along with optional equipment available to be purchased separately, will help facilitate these process requirements.
The FPA-3030i5+ represents a new product platform, designed specifically to provide a solution for a variety of users, including power semiconductor, LED and MEMS manufacturers.
The FPA-3030 platform represents an upgrade to earlier Canon "FPA- 3000 platform" steppers. The FPA-3030i5+ features an overhauled software structure and electrical control system that allow application of optional advanced hardware (e.g., projection lens, wafer stage, and alignment system) that is not compatible with traditional FPA-3000 platform steppers.
The FPA-3030i5+ is capable of providing imaging resolution below 0.35 m, while maintaining overlay accuracy of less than or equal to 40nm and throughput equal to or in excess of 104 wafers per hour. Canon developed the FPA-3030i5+ system to meet and exceed the imaging, overlay and productivity requirements of those environmentally conscious devices and MEMS manufacturers.
The FPA-3030 platform allows the use of optional equipment designed for the processing of silicon (Si), sapphire (Al2O3), silicon carbide (SiC) and a variety of wafer materials used in environmentally conscious device manufacturing. Optional equipment for the FPA-3030i5+ includes warped-wafer handling systems to allow processing of distorted substrates, and advanced image processing systems for clear substrates.
With the purchase of the optional Multi-Size Wafer Kit, the FPA- 3030i5+ stepper can also be configured to process multiple wafer sizes, and can be equipped with other optional equipment to help improve productivity and efficiency.
Demand for low-power consumption systems and vehicles, social infrastructure improvements such as wind, solar and smart grid products have increased as society becomes more aware of the importance of conserving energy and reducing environmental impacts. Semiconductor lithography equipment supporting environmentally conscious devices must provide process flexibility to meet the wide range of requirements from manufacturers of environmentally conscious devices.
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